SMD resistors are divided into different packages. The term package refers to the size, shape and/or lead configuration of an electronic component. For instance, an IC chip that is has leads in two rows down opposite sides of the chip is called a Dual Inline Package (DIP) chip. In SMD resistors, resistor package designators tell the length and width of the resistor.
SMDs are smaller than their traditional counterparts. They are often square, rectangular or oval in shape, with very low profiles. Instead of wire leads that go through the PCB, SMD’s have small leads or pins that are soldered to pads on the surface of the board. This eliminates the need for holes in the board, and lets both sides of the board be more fully used.
The board is then sent through a reflow soldering oven. In this oven, the board is slowly brought up to a temperature that will melt the solder. Once cooled, the board is cleaned to remove solder flux residue and stray solder particles. A visual inspection checks for missing or out-of-position parts and that the board is clean.