The series benefits from an impervious internal passivation layer applied in addition to the normal protective coating. When constructing the NAP Chip Series, a Ni/Cr thin-film material is selectively deposited on an alumina substrate, together with Ni and Sn metallic contacts at each end layer plating. The NAP chips are heat treated to give the required temperature coefficient (TCR) and stability, and then a precisely controlled laser trim process adjusts the resistance value. NAP series, ROSH compliant and lead free, is available in taping packaging.
The thin film precision chip resistor NAP Series offering solutions to precision test and measurement and voltage regulation across medical monitoring equipment markets, industrial, and consumer electronics demanding tight tolerance, low TCR, and high power rating performance.