| Power rating | Body length (l) | Body diameter (d) | Lead length (a) | Lead diameter (da) |
| Watt | mm | mm | mm | mm |
| 1/8 (0.125) | 3.0 ± 0.3 | 1.8 ± 0.3 | 28 ± 3 | 0.45 ± 0.05 |
| 1/4 (0.25) | 6.5 ± 0.5 | 2.5 ± 0.3 | 28 ± 3 | 0.6 ± 0.05 |
| 1/2 (0.5) | 8.5 ± 0.5 | 3.2 ± 0.3 | 28 ± 3 | 0.6 ± 0.05 |
| 1 | 11 ± 1 | 5 ± 0.5 | 28 ± 3 | 0.8 ± 0.05 |
Sometimes surface mount resistors are also used as MELF packages (Metal Electrode Leadless Face). The main advantage of using MELF in stead of standard SMD packages is the lower thermal coefficient and better stability. The TCR of thin film MELF resistors is often between 25-50 ppm/K while standard thick film SMD resistors often have a TCR of > 200 ppm/K. This is possible due to the cylindrical construction of MELF resistors. This cylindrical construction also gives the package distinct disadvantages, mainly when the components have to be placed using pick and place machines. Because of their round shape a special suction cup and more vacuum is required. There are three common MELF package sizes: MicroMELF, MiniMELF and MELF. The following table lists the characteristics of these types.
| Name | Code | Length | Diameter | Power | |
| mm | mm | Watt | |||
| MicroMELF | 0102 | 2.2 | 1.1 | 0.2 – 0.3 | |
| MiniMELF | 0204 | 3.6 | 1.4 | 0.25 – 0.4 | |
| MELF | 0207 | 5.8 | 2.2 | 0.4 – 1.0 |
Microhm Electronics' MELF resistor HPMRY also conform to above standards.
